发明申请
US20050161144A1 Bond apparatus, bonding method and the composition bonded thereby
审中-公开
粘合装置,粘合方法和由此粘合的组合物
- 专利标题: Bond apparatus, bonding method and the composition bonded thereby
- 专利标题(中): 粘合装置,粘合方法和由此粘合的组合物
-
申请号: US11084617申请日: 2005-03-17
-
公开(公告)号: US20050161144A1公开(公告)日: 2005-07-28
- 发明人: Shoji Nakajima , Kumiko Mihara
- 申请人: Shoji Nakajima , Kumiko Mihara
- 申请人地址: JP Osaka
- 专利权人: Kabushikikaisha Gingam
- 当前专利权人: Kabushikikaisha Gingam
- 当前专利权人地址: JP Osaka
- 优先权: JP2001-50629 20010226
- 主分类号: B32B17/12
- IPC分类号: B32B17/12 ; B29C65/06 ; B29C65/08 ; C09J5/06 ; D06Q1/10 ; B32B31/00
摘要:
To provide a method for bonding a second member with a fixed shape (e.g. crystal glass) to a first member with a flexible and flat configuration (e.g. cloth, leather, and the like) with a hot-melt adhesive in a short process so as to have a high peel resistance and a beautiful appearance, a bonding apparatus and a composition bonded thereby. The bonding method of the present invention comprises the steps of placing a second member with a fixed shape on a first member with a flexible and flat configuration with a hot-melt adhesive being sandwiched therebetween, heating at least the second member up to a temperature equal to or greater than a melting point of the hot-melt adhesive, and cooling the first member and the second member while pressing the second member so as to contact the first member closely.
信息查询