Invention Application
- Patent Title: Bonding Methods for Microchannel Plates
- Patent Title (中): 微通道板的粘合方法
-
Application No.: US10905847Application Date: 2005-01-24
-
Publication No.: US20050098614A1Publication Date: 2005-05-12
- Inventor: Niels JACKSEN , Michael IOSUE , Miguel SALDANA , Jay TUCKER
- Applicant: Niels JACKSEN , Michael IOSUE , Miguel SALDANA , Jay TUCKER
- Applicant Address: US CA Los Angeles
- Assignee: LITTON SYSTEMS, INC.
- Current Assignee: LITTON SYSTEMS, INC.
- Current Assignee Address: US CA Los Angeles
- Main IPC: B23K20/02
- IPC: B23K20/02 ; H01J43/24 ; B23K28/00

Abstract:
Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP (50) and multi-layer ceramic body (80) unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP (50) and the multi-layer ceramic body unit (80).
Public/Granted literature
- US07021522B2 Bonding methods for microchannel plates Public/Granted day:2006-04-04
Information query