- 专利标题： Thin film semiconductor package and method of fabrication
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申请号： US10996535申请日： 2004-11-24
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公开(公告)号： US20050093113A1公开(公告)日： 2005-05-05
- 发明人: Mou-Shiung Lin , Jin-Yuan Lee , Ching-Cheng Huang
- 申请人： Mou-Shiung Lin , Jin-Yuan Lee , Ching-Cheng Huang
- 专利权人： MEGIC CORPORATION
- 当前专利权人： MEGIC CORPORATION
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/68 ; H01L23/31 ; H01L23/538 ; H01L23/58
摘要：
A thin film semiconductor die circuit package is provided utilizing low dielectric constant (k) polymer material for the insulating layers of the metal interconnect structure. Five embodiments include utilizing glass, glass-metal composite, and glass/glass sandwiched substrates. The substrates form the base for mounting semiconductor dies and fabricating the thin film interconnect structure.
公开/授权文献
- US07397117B2 Chip package with die and substrate 公开/授权日：2008-07-08
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