Invention Application
US20050089593A1 Molding apparatus with a pressure sensor for packaging semiconductor device
审中-公开
具有用于封装半导体器件的压力传感器的成型装置
- Patent Title: Molding apparatus with a pressure sensor for packaging semiconductor device
- Patent Title (中): 具有用于封装半导体器件的压力传感器的成型装置
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Application No.: US10876609Application Date: 2004-06-28
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Publication No.: US20050089593A1Publication Date: 2005-04-28
- Inventor: Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
- Applicant: Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Priority: TW092129690 20031024
- Main IPC: B29C45/14
- IPC: B29C45/14 ; B29C45/40 ; B29C45/76 ; B29C45/77 ; B29C70/72
Abstract:
A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a pressure sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates the mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the pressure sensor for measuring the viscosity of the instant molding flow at the mold-cavity surface of the mold cavity is provided in the via of the mold chase.
Information query
