发明申请
- 专利标题: Integrated liquid cooling system for electrical components
- 专利标题(中): 电气元件集成液体冷却系统
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申请号: US10901749申请日: 2004-07-28
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公开(公告)号: US20050082040A1公开(公告)日: 2005-04-21
- 发明人: Hsieh Lee , Cheng-Tien Lai , Shi Zhou
- 申请人: Hsieh Lee , Cheng-Tien Lai , Shi Zhou
- 优先权: TW92218324 20031015
- 主分类号: F28F3/12
- IPC分类号: F28F3/12 ; H01L23/473 ; F25B21/02
摘要:
A liquid cooling system includes a cooling unit (100) and a coolant driving unit (200). The cooling unit includes a first cooling body (110) defining a first cavity, a second cooling body (130) defining a second cavity in communication with first cooling body (110), and a heat sink (150) sandwiched between the first and second cooling bodies. The coolant driving unit is in flow communication with the first and second cooling bodies respectively so that the first and second cooling bodies, and the coolant driving unit together form a loop. Circulation of the coolant in the loop causes the heat generated by the heat generating component to be capable of being transferred from the first and second cooling bodies to the heat sink for dissipation.
公开/授权文献
- US07028761B2 Integrated liquid cooling system for electrical components 公开/授权日:2006-04-18
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