发明申请
- 专利标题: METHOD AND APPARATUS FOR ELECTRICAL COMMONING OF CIRCUITS
- 专利标题(中): 电路电气通用方法与装置
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申请号: US10710145申请日: 2004-06-22
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公开(公告)号: US20050062493A1公开(公告)日: 2005-03-24
- 发明人: David Danovitch , Richard Langlois , Martin Lapointe , Robert-Paul Leclerc
- 申请人: David Danovitch , Richard Langlois , Martin Lapointe , Robert-Paul Leclerc
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 优先权: CA2441447 20030918
- 主分类号: G01R1/04
- IPC分类号: G01R1/04 ; G01R1/067 ; G01R31/28 ; G01R31/26
摘要:
Improved methods and apparatus is disclosed for electrical testing of electronic circuits such as those existing in microcircuit devices including chip carriers, printed circuit boards and substrates. The invention provides for the testing of the continuity of electronic circuits in progressively smaller devices having increased density of circuits and having pads closely spaced. A quasi-fluidized bed of conductive particles is provided for effectively contacting pads on a first side of a substrate. Pads on another side of the substrate which are connected to the pads on the first side are then contacted by a test device. The circuit interconnecting respective pads on the two sides of the substrate can then be assessed for electrical continuity.
公开/授权文献
- US07038462B2 Method and apparatus for electrical commoning of circuits 公开/授权日:2006-05-02
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