Invention Application
- Patent Title: COMPUTER SYSTEM WITH A LIQUID-COOLING THERMAL MODULE HAVING A PLURALITY OF PUMPS
- Patent Title (中): 具有多个泵浦的液体冷却模块的计算机系统
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Application No.: US10605851Application Date: 2003-10-30
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Publication No.: US20040233632A1Publication Date: 2004-11-25
- Inventor: Hung Chang
- Priority: TW092113655 20030520
- Main IPC: H05K007/20
- IPC: H05K007/20

Abstract:
A computer system includes a processor for processing data, a storage unit for storing data, and a liquid-cooling thermal module for dissipating heat generated by the processor. The thermal module has a heat pipe adjacent to the processor for conducting heat, and a cooling device. The cooling device has a plurality of tanks, which are connected with each other.
Public/Granted literature
- US07057894B2 Computer system with a liquid-cooling thermal module having a plurality of pumps Public/Granted day:2006-06-06
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