Invention Application
- Patent Title: Temperature adjustment device and laser module
- Patent Title (中): 温度调节装置和激光模块
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Application No.: US10662521Application Date: 2003-09-16
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Publication No.: US20040211190A1Publication Date: 2004-10-28
- Inventor: Tatsuhiko Ueki , Mamoru Shimada , Yuji Hiratani
- Applicant: The Furukawa Electric Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Priority: JP2002-270501 20020917
- Main IPC: F25B021/02
- IPC: F25B021/02 ; F25D023/12

Abstract:
A temperature adjustment device has a first thermoelectric cooling module, a second thermoelectric cooling module on which the first thermoelectric cooling module is provided, and a heat generating element which is provided on the first thermoelectric cooling module and a temperature thereof is adjusted, where assuming that a substrate area of the first thermoelectric cooling module on which the heat generating element is provided is S1 (mm2) and that an amount of generated heat of the heat generating element is Qd (mW), the relationship of 20nullQd/S1null200 is met.
Public/Granted literature
- US06837059B2 Temperature adjustment device and laser module Public/Granted day:2005-01-04
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