Invention Application
- Patent Title: Chassis subassembly module and method for using same
- Patent Title (中): 机箱子组件模块及其使用方法
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Application No.: US10262575Application Date: 2002-10-01
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Publication No.: US20040060750A1Publication Date: 2004-04-01
- Inventor: Adrian B. Chernoff , Tommy E. White
- Main IPC: B60K001/00
- IPC: B60K001/00
Abstract:
A chassis subassembly module having a portion of a chassis structural frame and vehicular componentry facilitates the assembly of a chassis having systems responsive to non-mechanical control signals and a simplified body-attachment interface. A method of employing chassis subassembly modules to assemble chassis is also provided.
Public/Granted literature
- US06923282B2 Chassis subassembly module and method for using same Public/Granted day:2005-08-02
Information query
