Invention Application
- Patent Title: Adhesive system for absorbent structures
-
Application No.: US10306549Application Date: 2002-11-26
-
Publication No.: US20030124336A1Publication Date: 2003-07-03
- Inventor: James M. Keane , Andrew M. Lake , Steven J. Nielsen , Shelley R. Rasmussen
- Main IPC: B32B005/14
- IPC: B32B005/14 ; B32B003/26 ; B32B007/12

Abstract:
An absorbent structure that includes: (1) a liquid permeable cover having a first surface area; (2) at least one layer of at least one liquid management material having a second surface area that is less than the first surface area; and (3) an adhesive system joining the liquid permeable cover and the liquid management material. The continuous layer of adhesive overlaying the permeable cover material desirably has a basis weight of 7.5 gsm or less. For example, layer of adhesive may have a basis weight of 4 gsm or 1.0 gsm or less .The absorbent structure may be mechanically post-treated. For example, the absorbent structure may be introduced into a nip and/or subjected to mechanical post treatments such as, for example, embossing, perforating, brushing, creping, aperturing and the like. A method of making an absorbent structure that may include the following steps: (1) providing a liquid permeable nonwoven cover composed of a matrix of fibrous material and having a plurality of individual exposed fiber surfaces; (2) applying a thin, substantially continuous layer of adhesive material coating to at least a portion of the individual exposed fiber surfaces of individual fiber surfaces; (3) providing at least one layer of at least one liquid management material; and (4) joining the liquid permeable cover and the liquid management material. A non-contact adhesive system for joining dissimilar material components in which an adhesive is applied at a rate of less than 7.5 gsm utilizing a non-contact applicator in several generally parallel, substantially or totally non-intersecting lines after the cover and discrete liquid management material (distribution layer) are joined and exit a post treatment step such as, for example, an aperturing module. The adhesive could also be applied in several wavy lines, sinusoidal lines, parallel lines and other similar non-intersecting adhesive configurations.
Information query