Invention Application
- Patent Title: Thermal interface material
- Patent Title (中): 热界面材料
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Application No.: US10027207Application Date: 2001-12-26
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Publication No.: US20030118826A1Publication Date: 2003-06-26
- Inventor: Ronald A. Greinke , Daniel W. Krassowski
- Main IPC: B32B009/00
- IPC: B32B009/00

Abstract:
A thermal interface and a thermal interface as part of a thermal management system that comprises a heat source, and a cooling module. The heat source has an external surface; the thermal interface is a flexible graphite sheet article having two parallel planar surfaces, with the first planar surface of the thermal interface being in operative contact with the external surface of the heat source and the second planar surface being in contact with the cooling module. The graphite sheet contains oil.
Public/Granted literature
- US06746768B2 Thermal interface material Public/Granted day:2004-06-08
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