Invention Application
US20030016895A1 Structure and method for fabricating semiconductor structures and devices utilizing photonic crystals 审中-公开
使用光子晶体制造半导体结构和器件的结构和方法

Structure and method for fabricating semiconductor structures and devices utilizing photonic crystals
Abstract:
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials. Photonic crystal structures may be integrally provided with such semiconductor structures, which semiconductor structures may also include optically active devices and control circuitry.
Information query
Patent Agency Ranking
0/0