Invention Grant
- Patent Title: Electronic device comprising metal housing and manufacturing method therefor
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Application No.: US17641004Application Date: 2020-05-19
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Publication No.: US12231158B2Publication Date: 2025-02-18
- Inventor: Jeongseok Park , Yiming Chen , Minwoo Yoo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: CN201910851478.8 20190906
- International Application: PCT/KR2020/006524 WO 20200519
- International Announcement: WO2021/045346 WO 20210311
- Main IPC: H04B1/3888
- IPC: H04B1/3888 ; H04M1/02

Abstract:
According to various embodiments of the present invention, an electronic device may comprise: a housing comprising a first surface, a second surface, and a side surface surrounding the space between the first surface and the second surface; and a display provided in the space and exposed via the first surface. At least one of the first surface, the second surface, and the side surface may comprise: a metal alloy including at least one pore in the surface; a metal member occupying at least a portion of the inner space of the at least one pore; and an oxidation film which contacts the metal member and at least a portion of the metal alloy.
Public/Granted literature
- US20220345169A1 ELECTRONIC DEVICE COMPRISING METAL HOUSING AND MANUFACTURING METHOD THEREFOR Public/Granted day:2022-10-27
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