Invention Grant
- Patent Title: Methods to selectively embed magnetic materials in substrate and corresponding structures
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Application No.: US17873518Application Date: 2022-07-26
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Publication No.: US12154715B2Publication Date: 2024-11-26
- Inventor: Cheng Xu , Kyu-Oh Lee , Junnan Zhao , Rahul Jain , Ji Yong Park , Sai Vadlamani , Seo Young Kim
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/02 ; H01F27/24 ; H05K1/18

Abstract:
Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.
Public/Granted literature
- US20220367104A1 METHODS TO SELECTIVELY EMBED MAGNETIC MATERIALS IN SUBSTRATE AND CORRESPONDING STRUCTURES Public/Granted day:2022-11-17
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