- 专利标题： Supports for thinned semiconductor substrates and related methods
-
申请号： US18507176申请日： 2023-11-13
-
公开(公告)号： US12132005B2公开(公告)日： 2024-10-29
- 发明人: Michael J. Seddon , Francis J. Carney
- 申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 申请人地址： US AZ Scottsdale
- 专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人地址： US AZ Scottsdale
- 代理商 Adam R. Stephenson, LTD.
- 主分类号： H01L23/544
- IPC分类号： H01L23/544 ; H01L23/14 ; H01L23/32 ; H01L25/065
摘要：
Implementations of a semiconductor substrate may include a wafer including a first side and a second side; and a support structure coupled to the wafer at a desired location on the first side, the second side, or both the first side and the second side. The support structure may include an organic compound.
公开/授权文献
信息查询
IPC分类:
