- 专利标题： Manufacturing method of package structure
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申请号： US17523919申请日： 2021-11-11
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公开(公告)号： US12131917B2公开(公告)日： 2024-10-29
- 发明人: Yi-Hung Lin , Wen-Hsiang Liao , Cheng-Chi Wang , Yi-Chen Chou , Fuh-Tsang Wu , Ker-Yih Kao
- 申请人： Innolux Corporation
- 申请人地址： TW Miao-Li County
- 专利权人： Innolux Corporation
- 当前专利权人： Innolux Corporation
- 当前专利权人地址： TW Miaoli County
- 代理机构： JCIPRNET
- 优先权： CN 2011415756.4 2020.12.07
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/02 ; H01L21/48 ; H01L23/31
摘要：
A manufacturing method of a package structure including the following steps is provided. A carrier is provided. An anti-warpage structure is formed on the carrier. And a redistribution layer is formed on the carrier. In the normal direction of the carrier, a warpage trend of the anti-warpage structure is opposite to a warpage trend of the redistribution layer.
公开/授权文献
- US20220181167A1 MANUFACTURING METHOD OF PACKAGE STRUCTURE 公开/授权日：2022-06-09
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