A method of manufacturing a light emitting device includes: providing a light emitting element comprising: a semiconductor laminate having a first surface, a second surface, and a lateral surface between the first and second surfaces, and an electrode disposed at the second surface; disposing a resin layer in an A-stage state on a support; placing the light emitting element on an upper surface of the resin layer while the upper surface of the resin layer and the first surface of the semiconductor laminate face each other; heating the resin layer at a first temperature to reduce a viscosity of the resin layer and causing the light emitting element to sink due to its own weight such that the second surface of the semiconductor laminate is exposed; and curing the resin layer by heating the resin layer at a second temperature higher than the first temperature, thereby forming a resin member.