- 专利标题: Transistor gate contacts and methods of forming the same
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申请号: US17325477申请日: 2021-05-20
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公开(公告)号: US12119259B2公开(公告)日: 2024-10-15
- 发明人: Kai-Hsuan Lee , Sai-Hooi Yeong , Chi On Chui
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Slater Matsil, LLP
- 主分类号: H01L21/768
- IPC分类号: H01L21/768 ; H01L21/8234 ; H01L23/522 ; H01L29/417 ; H01L29/66
摘要:
In an embodiment, a device includes: a source/drain region adjoining a channel region of a substrate; a contact etch stop layer on the source/drain region; a first source/drain contact extending through the contact etch stop layer, the first source/drain contact connected to the source/drain region; a gate structure on the channel region; a gate contact connected to the gate structure; and a contact spacer around the gate contact, where the contact spacer, the gate structure, the contact etch stop layer, and the substrate collectively define a void between the gate structure and the first source/drain contact.
公开/授权文献
- US20220310445A1 Transistor Gate Contacts and Methods of Forming the Same 公开/授权日:2022-09-29
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