A hot plate cooling system is provided, configured to cool a hot plate, including a chamber and a cooling module. The hot plate is placed in the chamber. The cooling module extends into the chamber and faces the hot plate. The cooling module includes a nozzle member, a shell member, and a discharge channel. The nozzle member faces the hot plate for spraying a working fluid onto the hot plate. The shell member has a receiving groove surrounding the nozzle member. The discharge channel is connected to the shell member and communicates with the receiving groove. When the nozzle member sprays the working fluid to cool the hot plate, the working fluid is conveyed through the nozzle member toward a surface of the hot plate, and the working fluid is sequentially discharged from the hot plate cooling system through the receiving groove to the discharge channel.