- 专利标题: Smart compression/decompression schemes for efficiency and superior results
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申请号: US17845039申请日: 2022-06-21
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公开(公告)号: US12118756B2公开(公告)日: 2024-10-15
- 发明人: Abhishek R. Appu , Kiran C. Veernapu , Prasoonkumar Surti , Joydeep Ray , Altug Koker , Eric G. Liskay
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: INTEL CORPORATION
- 当前专利权人: INTEL CORPORATION
- 当前专利权人地址: US CA Santa Clara
- 代理机构: JAFFERY WATSON MENDOSA HAMILTON LLP
- 主分类号: G06T9/00
- IPC分类号: G06T9/00
摘要:
A mechanism is described for facilitating smart compression/decompression schemes at computing devices. A method of embodiments, as described herein, includes unifying a first compression scheme relating to three-dimensional (3D) content and a second compression scheme relating to media content into a unified compression scheme to perform compression of one or more of the 3D content and the media content relating to a processor including a graphics processor.
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