发明授权
- 专利标题： Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
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申请号： US17598305申请日： 2019-03-27
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公开(公告)号： US12116451B2公开(公告)日： 2024-10-15
- 发明人: Hideyuki Katagi , Yuki Nakamura , Kazumasa Fukuda , Tomohiro Ikeda , Lin Tian , Kei Tougasaki , Naoki Maruyama , Yoshitaka Takezawa
- 申请人： SHOWA DENKO MATERIALS CO., LTD.
- 申请人地址： JP Tokyo
- 专利权人： RESONAC CORPORATION
- 当前专利权人： RESONAC CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： SOLARIS Intellectual Property Group, PLLC
- 国际申请： PCT/JP2019/013363 2019.03.27
- 国际公布： WO2020/194601A 2020.10.01
- 进入国家日期： 2021-09-27
- 主分类号： C08G59/14
- IPC分类号： C08G59/14 ; C08G59/16 ; C08G59/24 ; C08G59/28 ; C08G59/30 ; C08G59/40 ; C08G59/50 ; C08G59/68 ; C08L63/00
摘要：
An epoxy resin includes a reaction product between: an epoxy compound having a mesogenic structure; and at least one selected from the group consisting of an aromatic hydroxycarboxylic acid having a carboxy group and a hydroxy group bonded to an aromatic ring and an aromatic dicarboxylic acid having two carboxy groups bonded to an aromatic group.
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