Invention Grant
- Patent Title: Three dimensional electrospun biomedical patch for facilitating tissue repair
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Application No.: US18159412Application Date: 2023-01-25
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Publication No.: US12109334B2Publication Date: 2024-10-08
- Inventor: Matthew R. MacEwan
- Applicant: Washington University
- Applicant Address: US MO St. Louis
- Assignee: Washington University
- Current Assignee: Washington University
- Current Assignee Address: US MO St. Louis
- Agency: Armstrong Teasdale LLP
- The original application number of the division: US14429976
- Main IPC: A61L27/18
- IPC: A61L27/18 ; A61F13/02 ; A61L15/26 ; A61L15/44 ; A61L15/64 ; A61L27/26 ; A61L27/54 ; A61L27/58 ; A61L27/60 ; A61L31/04 ; B29C48/18 ; B32B5/02 ; B32B5/26 ; B32B7/02 ; B32B7/12 ; D01D5/00 ; D04H1/728 ; D04H3/16

Abstract:
A three-dimensional electrospun biomedical patch includes a first polymeric scaffold having a first structure of deposited electrospun fibers extending in a plurality of directions in three dimensions to facilitate cellular migration for a first period of time upon application of the biomedical patch to a tissue, wherein the first period of time is less than twelve months, and a second polymeric scaffold having a second structure of deposited electrospun fibers. The second structure of deposited electrospun fibers includes the plurality of deposited electrospun fibers configured to provide structural reinforcement for a second period of time upon application of the three-dimensional electrospun biomedical patch to the tissue wherein the second period of time is less than twelve months. The three-dimensional electrospun biomedical patch is sufficiently pliable and resistant to tearing to enable movement of the three-dimensional electrospun biomedical patch with the tissue.
Public/Granted literature
- US20230347023A1 THREE DIMENSIONAL ELECTROSPUN BIOMEDICAL PATCH FOR FACILITATING TISSUE REPAIR Public/Granted day:2023-11-02
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