Invention Grant
- Patent Title: Memory and method for manufacturing same
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Application No.: US17479201Application Date: 2021-09-20
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Publication No.: US12108588B2Publication Date: 2024-10-01
- Inventor: Kui Zhang
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN 2110758009.9 2021.07.05
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L29/66 ; H01L29/78

Abstract:
A memory and a method for manufacturing the same are provided. The memory includes a substrate; at least one pair of transistors on a surface of the substrate, in which conductive channels of the transistors extend in a direction perpendicular to the surface of the substrate; storage layers, which each are located, in the direction perpendicular to the surface of the substrate, on a side surface of each of the transistors, the storage layers are interconnected with the conductive channels of the transistors, any one of the storage layers is located between the pair of transistors, and the storage layers are configured to store electric charges and transfer the electric charges between the storage layers and the conductive channels interconnected therewith.
Public/Granted literature
- US20230005915A1 MEMORY AND METHOD FOR MANUFACTURING SAME Public/Granted day:2023-01-05
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