- 专利标题: Methods for etching glass-based substrates
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申请号: US17893398申请日: 2022-08-23
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公开(公告)号: US12103889B2公开(公告)日: 2024-10-01
- 发明人: Huayun Deng , Melanie Lian Geiger , Richard Allen Hayes , Mingqian He , Yuhui Jin , Govindarajan Natarajan , Weijun Niu , Brian Paul Usiak , David Lee Weidman
- 申请人: CORNING INCORPORATED
- 申请人地址: US NY Corning
- 专利权人: Corning Incorporated
- 当前专利权人: Corning Incorporated
- 当前专利权人地址: US NY Corning
- 代理商 William J. Tucker
- 主分类号: C03C15/00
- IPC分类号: C03C15/00
摘要:
Glass-based substrates are described herein that may be processed by methods including applying a cover article onto a glass-based substrate, submerging the glass-based substrate in an etchant, and maintaining the submersion of the glass-based substrate in the etchant. The glass-based substrate may include a covered surface portion and an exposed surface portion. At least a portion of the covered surface portion may be in direct contact with the cover article. The covered surface portion may not be in contact with the etchant and the exposed surface portion may be in direct contact with the etchant. The etchant may contact the exposed surface portion and the cover article fora time sufficient to etch the exposed surface portion. The cover article may provide a barrier between the etchant and the covered surface portion for the entirety of the submerging.
公开/授权文献
- US20230064818A1 METHODS FOR ETCHING GLASS-BASED SUBSTRATES 公开/授权日:2023-03-02
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