- 专利标题: Resin composition for plating, and plated molded article
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申请号: US17727446申请日: 2022-04-22
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公开(公告)号: US12098229B2公开(公告)日: 2024-09-24
- 发明人: Takayoshi Fujiwara , Nana Matsumoto
- 申请人: NIPPON A&L INC.
- 申请人地址: JP Osaka
- 专利权人: NIPPON A&L INC.
- 当前专利权人: NIPPON A&L INC.
- 当前专利权人地址: JP Osaka
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: JP 16136315 2016.07.08
- 主分类号: C08L25/12
- IPC分类号: C08L25/12 ; C08F212/10 ; C08F220/44 ; C08F253/00 ; C08L51/04 ; C08L69/00 ; C25D5/56
摘要:
To provide a resin composition for plating and a plated molded article which are excellent in impact resistance and fluidity and which satisfy plating adhesion strength, plating deposition rate and thermal cycle resistance in a well-balanced manner. A resin composition for plating, containing a polycarbonate resin (A), a graft copolymer (B) and a copolymer (C), wherein the resin composition satisfies the following conditions (1) to (5):
(1) a content of the polycarbonate resin (A) is 20 to 60% by mass based on 100% by mass of a total of (A), (B) and (C);
(2) the graft copolymer (B) is a graft copolymer obtained by graft polymerization of a rubbery polymer and a monomer component including an aromatic vinyl-based monomer;
(3) the copolymer (C) is a copolymer obtained by polymerization of a monomer component including an aromatic vinyl-based monomer and a vinyl cyanide-based monomer;
(4) a content of the rubbery polymer is 7 to 20% by mass relative to the resin composition; and
(5) a content of an oligomer component is less than 1% by mass relative to the resin composition.
(1) a content of the polycarbonate resin (A) is 20 to 60% by mass based on 100% by mass of a total of (A), (B) and (C);
(2) the graft copolymer (B) is a graft copolymer obtained by graft polymerization of a rubbery polymer and a monomer component including an aromatic vinyl-based monomer;
(3) the copolymer (C) is a copolymer obtained by polymerization of a monomer component including an aromatic vinyl-based monomer and a vinyl cyanide-based monomer;
(4) a content of the rubbery polymer is 7 to 20% by mass relative to the resin composition; and
(5) a content of an oligomer component is less than 1% by mass relative to the resin composition.
公开/授权文献
- US20220251271A1 RESIN COMPOSITION FOR PLATING, AND PLATED MOLDED ARTICLE 公开/授权日:2022-08-11
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