- 专利标题： Ink composition, method for forming a conductive member, and conductive device
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申请号： US17591264申请日： 2022-02-02
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公开(公告)号： US12091567B2公开(公告)日： 2024-09-17
- 发明人: Zhenggang Li , Yeng Ming Lam , Chee Lip Gan , Jaewon Kim , Alfred A. Zinn
- 申请人： Kuprion, Inc.
- 申请人地址： US CA San Jose
- 专利权人： Kuprion Inc.
- 当前专利权人： Kuprion Inc.
- 当前专利权人地址： US CT Waterbury
- 代理机构： Carmody Torrance Sandak & Hennessey LLP
- 主分类号： C09D11/52
- IPC分类号： C09D11/52 ; B22F1/052 ; B22F1/0545 ; B22F1/102 ; B41M5/00 ; B41M7/00 ; B82Y30/00 ; B82Y40/00 ; C09D5/24 ; C09D11/033 ; C09D11/037 ; C09D11/322 ; C09D11/36 ; C09D11/38 ; H01B1/02 ; H01B1/22 ; H01B5/14 ; H01B13/00 ; H05K1/09 ; H05K3/12 ; B22F7/08 ; B22F10/10 ; B22F10/25 ; B22F10/28 ; B22F10/40 ; B22F10/64
摘要：
According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.
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