- 专利标题： Electrically assisted pressure joining apparatus and electrically assisted pressure joining method
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申请号： US17293038申请日： 2018-11-14
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公开(公告)号： US12090566B2公开(公告)日： 2024-09-17
- 发明人: Sung-Tae Hong , Doo-Man Chun , Hong-Seok Park , Heung Nam Han , Ju Won Park , Yongfang Li , Dinh Son Nguyen
- 申请人： UNIVERSITY OF ULSAN FOUNDATION FOR INDUSTRY COOPERATION , SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
- 申请人地址： KR Ulsan
- 专利权人： UNIVERSITY OF ULSAN FOUNDATION FOR INDUSTRY COOPERATION,SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
- 当前专利权人： UNIVERSITY OF ULSAN FOUNDATION FOR INDUSTRY COOPERATION,SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
- 当前专利权人地址： KR Ulsan; KR Seoul
- 代理机构： Revolution IP, PLLC
- 国际申请： PCT/KR2018/013932 2018.11.14
- 国际公布： WO2020/101065A 2020.05.22
- 进入国家日期： 2021-05-12
- 主分类号： B23K11/30
- IPC分类号： B23K11/30 ; B33Y10/00 ; B33Y80/00
摘要：
An electrically assisted pressure joining apparatus and an electrically assisted pressure joining method join a first metal member and a second metal member together, and includes an electrode portion, an intermediate portion including a plurality of micropores and inserted between a first metal member and a second metal member, and a pressure portion connected to the electrode portion to receive a current from the electrode portion and transfer the current to the first metal member and the second metal member to apply a pressure to the first metal member such that the first metal member and the second metal member are joined together by the intermediate portion.
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