- 专利标题： Electronic device and method for manufacturing electronic device
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申请号： US17622256申请日： 2020-06-10
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公开(公告)号： US12087721B2公开(公告)日： 2024-09-10
- 发明人: Tomonao Kikuchi
- 申请人： KYOCERA Corporation
- 申请人地址： JP Kyoto
- 专利权人： KYOCERA CORPORATION
- 当前专利权人： KYOCERA CORPORATION
- 当前专利权人地址： JP Kyoto
- 代理机构： Volpe Koenig
- 优先权： JP 19120133 2019.06.27
- 国际申请： PCT/JP2020/022837 2020.06.10
- 国际公布： WO2020/261993A 2020.12.30
- 进入国家日期： 2021-12-23
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; B22F7/06 ; F21S8/08 ; F21S41/141 ; F21S43/14 ; F21Y115/10 ; H01L33/48 ; H01L33/62
摘要：
An electronic device characterized by including a substrate, a bonding layer provided on the substrate, the bonding layer containing copper in an amount of greater than 0 mass % but 60 mass % or less, the copper having its crystal grain size of 50 nm or less, an electronic component provided on the bonding layer, and a coating film covering a side of the bonding layer, the coating film containing at least one compound selected from copper (I) oxide (Cu2O) and copper (II) oxide (CuO).
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