- Patent Title: Chemical liquid preparation device, and substrate processing device
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Application No.: US17867693Application Date: 2022-07-19
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Publication No.: US12064739B2Publication Date: 2024-08-20
- Inventor: Hajime Nishide , Takashi Izuta , Takatoshi Hayashi , Katsuhiro Fukui , Koichi Okamoto , Kazuhiro Fujita , Atsuyasu Miura , Kenji Kobayashi , Sei Negoro , Hiroki Tsujikawa
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: JCIPRNET
- Priority: JP 17183007 2017.09.22
- The original application number of the division: US16114253 2018.08.28
- Main IPC: B01F15/04
- IPC: B01F15/04 ; B01F3/04 ; B01F15/00 ; B01F23/231 ; B01F23/237 ; B01F35/21 ; B01F35/22 ; B01F35/82 ; G05D11/00 ; G05D21/02 ; H01L21/306 ; H01L21/3213 ; H01L21/67 ; B01F101/58

Abstract:
A chemical liquid preparation method of preparing a chemical liquid for treating a film formed on a substrate, including a gas dissolving process in which an oxygen-containing gas and an inert-gas-containing gas are dissolved in the chemical liquid by supplying the oxygen-containing gas which contains oxygen gas and the inert-gas-containing gas which contains an inert gas to a chemical liquid, wherein in the gas dissolving process, a dissolved oxygen concentration in the chemical liquid is adjusted by setting a mixing ratio between the oxygen-containing gas and the inert-gas-containing gas supplied to the chemical liquid as a mixing ratio corresponding to a predetermined target dissolved oxygen concentration.
Public/Granted literature
- US20220347641A1 CHEMICAL LIQUID PREPARATION DEVICE, AND SUBSTRATE PROCESSING DEVICE Public/Granted day:2022-11-03
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