Invention Grant
- Patent Title: Method for transporting wafers
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Application No.: US17748932Application Date: 2022-05-19
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Publication No.: US12062561B2Publication Date: 2024-08-13
- Inventor: Wei-Chih Chen , Shi-Chi Chen , Ting-Wei Wang , Jen-Ti Wang , Kuo-Fong Chuang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67

Abstract:
A method includes moving a wafer transport device to a position above a load port; lowering a hoist unit of the wafer transport device above the load port, wherein the wafer transport device has a plurality of belts, each of the belts is connected to the hoist unit and wound around a respective belt winding drum; detecting sound waves from the belts by using at least one acoustic sensor to measure tensions of the belts; and comparing the tensions from the belts to determine an inclination of the hoist unit.
Public/Granted literature
- US20220285190A1 METHOD FOR TRANSPORTING WAFERS Public/Granted day:2022-09-08
Information query
IPC分类: