Invention Grant
- Patent Title: System and method for bending crystal wafers for use in high resolution analyzers
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Application No.: US17892020Application Date: 2022-08-19
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Publication No.: US12062465B2Publication Date: 2024-08-13
- Inventor: Ayman H. Said , Thomas Gog , Jung Ho Kim , Emily K. Aran
- Applicant: UCHICAGO ARGONNE, LLC
- Applicant Address: US IL Chicago
- Assignee: UCHICAGO ARGONNE, LLC
- Current Assignee: UCHICAGO ARGONNE, LLC
- Current Assignee Address: US IL Chicago
- Agency: CHERSKOV FLAYNIK & GURDA, LLC
- Main IPC: G21K1/06
- IPC: G21K1/06

Abstract:
The invention provides a method for fabricating analyzers, the method comprising providing a radiation manipulating material on a first surface of a flexible support; contacting a second surface of the flexible support to a permeable mold, wherein the mold has a first flexible support contact surface and a second surface; and applying negative pressure to the second side of the flexible support to cause the flexible support to conform to the first flexible support contact surface of the mold. Also provided is a system for fabricating crystal analyzers, the system comprising crystal structures reversibly attached to a flexible support; a porous mold reversibly contacting the flexible support, wherein the mold defines a topography; and a negative pressure applied to the flexible support to cause the crystal structures to conform to the topography.
Public/Granted literature
- US20240062928A1 SYSTEM AND METHOD FOR BENDING CRYSTAL WAFERS FOR USE IN HIGH RESOLUTION ANALYZERS Public/Granted day:2024-02-22
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