发明授权
- 专利标题: Cutting device
-
申请号: US17702966申请日: 2022-03-24
-
公开(公告)号: US12053900B2公开(公告)日: 2024-08-06
- 发明人: Yasuhito Shikama , Naoya Sakai , Kentaro Sugiyama
- 申请人: BROTHER KOGYO KABUSHIKI KAISHA
- 申请人地址: JP Nagoya
- 专利权人: BROTHER KOGYO KABUSHIKI KAISHA
- 当前专利权人: BROTHER KOGYO KABUSHIKI KAISHA
- 当前专利权人地址: JP Nagoya
- 代理机构: K&L Gates LLP
- 优先权: JP 21053547 2021.03.26
- 主分类号: B26F1/38
- IPC分类号: B26F1/38 ; B26D7/01 ; B26D7/26 ; B26D7/00
摘要:
A cutting device includes a platen, a mounting portion, a movement mechanism, a processor, and a memory. The memory is configured to store computer-readable instructions that, when executed by the processor, instruct the processor to perform processes including acquiring a hardness-correspondence value corresponding to a hardness of a cutting object placed on the platen, acquiring cutting data for cutting a pattern from the cutting object, setting, based on the hardness-correspondence value, an offset amount used for a rotation correction to a greater value when the hardness of the cutting object is hard than when the hardness of the cutting object is soft, correcting, using the set offset amount, data, of the cutting data, corresponding to a direction change section, and performing cutting processing to cut the cutting object using a cutting blade, by controlling the movement mechanism in accordance with the corrected cutting data.
公开/授权文献
- US20220305690A1 CUTTING DEVICE 公开/授权日:2022-09-29
信息查询
IPC分类: