- 专利标题: Semiconductor device and method of manufacture
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申请号: US18447495申请日: 2023-08-10
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公开(公告)号: US12022660B2公开(公告)日: 2024-06-25
- 发明人: Meng-Han Lin , Sai-Hooi Yeong , Chi On Chui
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Slater Matsil, LLP
- 分案原申请号: US17463726 2021.09.01
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L21/8234 ; H01L23/522 ; H10B51/30 ; H10B51/40
摘要:
Semiconductor devices and methods of manufacture are provided wherein a ferroelectric random access memory array is formed with bit line drivers and source line drivers formed below the ferroelectric random access memory array. A through via is formed using the same processes as the processes used to form individual memory cells within the ferroelectric random access memory array.
公开/授权文献
- US20230389330A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE 公开/授权日:2023-11-30
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