- 专利标题： Subtractive patterning of interconnect structures
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申请号： US17447388申请日： 2021-09-10
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公开(公告)号： US12020949B2公开(公告)日： 2024-06-25
- 发明人: Dominik Metzler , Somnath Ghosh , John Christopher Arnold , Ekmini Anuja De Silva
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Stosch Sabo
- 主分类号： H01L21/3213
- IPC分类号： H01L21/3213 ; H01L21/768 ; G06F30/3953
摘要：
A method of making a back-end-of-line (BEOL) component includes filling spaces in a layer of metal material and a layer of hardmask material with a layer of scaffolding material. The method further includes forming at least one plug on top of the layer of metal material such that the at least one plug is integrally formed with the layer of scaffolding material. The method further includes removing the layer of hardmask material such that a top surface of the layer of metal material is exposed except where the at least one plug is formed on top of the layer of metal material. The method further includes recessing the layer of metal material where the top surface of the layer of metal material is exposed. The method further includes removing the scaffolding material.
公开/授权文献
- US20230084739A1 SUBTRACTIVE PATTERNING OF INTERCONNECT STRUCTURES 公开/授权日：2023-03-16
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