发明授权
- 专利标题: Polymer material, composition, and method of manufacturing semiconductor device
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申请号: US17515253申请日: 2021-10-29
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公开(公告)号: US12018107B2公开(公告)日: 2024-06-25
- 发明人: Koji Asakawa , Norikatsu Sasao , Shinobu Sugimura
- 申请人: KIOXIA CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: Kioxia Corporation
- 当前专利权人: Kioxia Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- 优先权: JP 19044104 2019.03.11
- 分案原申请号: US16562786 2019.09.06
- 主分类号: C08F220/14
- IPC分类号: C08F220/14 ; C08L33/10 ; G03F7/038 ; G03F7/039 ; H01L21/027 ; H01L21/311 ; G03F7/16 ; G03F7/20 ; H10B41/27 ; H10B43/27
摘要:
According to one embodiment, a polymer material is disclosed. The polymer material contains a polymer. The polymer contains a first monomer unit having a lone pair and an aromatic ring at a side chain, and a second monomer unit including a crosslinking group at a terminal of the side chain, with its molar ratio of 0.5 mol % to 10 mol % to all monomer units in the polymer. The polymer material can be used for manufacturing a composite film as a mask pattern for processing a target film on a substrate. The composite film can be formed by a process including, forming an organic film on the target film with the polymer material, patterning the organic film, and forming the composite film by impregnating a metal compound into the patterned organic film.
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