- 专利标题: Flux for resin-cored solder, resin-cored solder, and soldering method
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申请号: US18266377申请日: 2021-11-10
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公开(公告)号: US12017307B2公开(公告)日: 2024-06-25
- 发明人: Yoko Kurasawa , Motohiro Onitsuka , Hisashi Tokutomi , Kei Endo , Kazuyuki Hamamoto
- 申请人: Senju Metal Industry Co., Ltd. , DENSO CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: Senju Metal Industry Co., Ltd.,DENSO CORPORATION
- 当前专利权人: Senju Metal Industry Co., Ltd.,DENSO CORPORATION
- 当前专利权人地址: JP Tokyo; JP Tokyo
- 代理机构: The Webb Law Firm
- 优先权: JP 20205897 2020.12.11 JP 21154190 2021.09.22
- 国际申请: PCT/JP2021/041302 2021.11.10
- 国际公布: WO2022/123988A 2022.06.16
- 进入国家日期: 2023-06-09
- 主分类号: B23K35/362
- IPC分类号: B23K35/362 ; B23K1/20 ; B23K35/36
摘要:
Provided is a flux for resin-cored solder that is used in resin-cored solder that is supplied into a through hole formed along a central axis of a soldering iron. The flux includes 60% by mass to 99.9% by mass of a rosin ester to a total mass of the flux, 0.1% by mass to 15% by mass of a covalent halogen compound to the total mass of the flux, and more than 0% by mass to 10% by mass of rosin amine, N,N-diethyloctylamine, or rosin amine and N,N-diethyloctylamine to the total mass of the flux.
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