- 专利标题: Semiconductor device and semiconductor storage device
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申请号: US17410057申请日: 2021-08-24
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公开(公告)号: US11978806B2公开(公告)日: 2024-05-07
- 发明人: Hikari Tajima
- 申请人: KIOXIA CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: Kioxia Corporation
- 当前专利权人: Kioxia Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Kim & Stewart LLP
- 优先权: JP 21047615 2021.03.22
- 主分类号: H01L29/24
- IPC分类号: H01L29/24 ; H01L27/108 ; H01L29/786 ; H01L49/02 ; H10B12/00
摘要:
A semiconductor device includes a semiconductor layer including first and second regions and a third region therebetween, a gate insulating layer between the third region and a gate electrode, first and second electrodes connected to the first and second regions in a first direction, a first conductive layer between the first region and the first electrode and/or between the second region and the second electrode. The first conductive layer includes a metal element, aluminum, and nitrogen, and has first and second portions. An atomic concentration of the metal element is higher than that of aluminum in the first portion. An atomic concentration of aluminum is higher than that of the metal element in the second portion. The device further includes a second conductive layer between the oxide semiconductor layer and the first conductive layer. The second conductive layer includes oxygen and at least one of indium, zinc, tin, and cadmium.
公开/授权文献
- US20220302311A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE 公开/授权日:2022-09-22
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