• Patent Title: Magnetic sensor and magnetic sensor manufacturing method
  • Application No.: US17312444
    Application Date: 2019-10-21
  • Publication No.: US11977135B2
    Publication Date: 2024-05-07
  • Inventor: Tatsunori ShinoDaizo Endo
  • Applicant: SHOWA DENKO K.K.
  • Applicant Address: JP Tokyo
  • Assignee: Resonac Corporation
  • Current Assignee: Resonac Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP 18245501 2018.12.27
  • International Application: PCT/JP2019/041359 2019.10.21
  • International Announcement: WO2020/137119A 2020.07.02
  • Date entered country: 2021-06-10
  • Main IPC: G01R33/06
  • IPC: G01R33/06
Magnetic sensor and magnetic sensor manufacturing method
Abstract:
A magnetic sensor (1) includes: a nonmagnetic substrate (10); and a sensitive element (31) including a plurality of soft magnetic layers (105) (lower soft magnetic layer (105a) and upper soft magnetic layer (105b)) laminated on or above the substrate (10) and a conductor layer (106) laminated between the plurality of soft magnetic layers (105) and having higher conductivity than the plurality of soft magnetic layers (105). The sensitive element (31) has a longitudinal direction and a transverse direction and has uniaxial magnetic anisotropy in a direction intersecting the longitudinal direction. The sensitive element (31) is configured to sense a magnetic field by a magnetic impedance effect.
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