- 专利标题: Structural electronics wireless sensor nodes
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申请号: US16900159申请日: 2020-06-12
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公开(公告)号: US11977020B2公开(公告)日: 2024-05-07
- 发明人: Brian L. Wardle , Yosef Stein , Estelle Cohen , Michael Murray
- 申请人: Analog Devices, Inc. , Massachusetts Institute of Technology
- 申请人地址: US MA Norwood
- 专利权人: Analog Devices, Inc.,Massachusetts Institute of Technology
- 当前专利权人: Analog Devices, Inc.,Massachusetts Institute of Technology
- 当前专利权人地址: US MA Wilmington; US MA Cambridge
- 代理机构: Wolf, Greenfield & Sacks, P.C.
- 主分类号: G01N17/04
- IPC分类号: G01N17/04 ; G01N27/04 ; G01N27/22
摘要:
A structural electronics wireless sensor node is provided that includes layers of electronic components fabricated from patterned nanostructures embedded in an electrically conductive matrix. In some aspects, the structural electronics wireless sensor node includes a plurality of nanostructure layers that each form individual electronic components of the structural electronics wireless sensor node. In certain embodiments, the structural electronics wireless sensor node includes electronic components such as a resistor, a inductor, a capacitor, and/or an antenna.
公开/授权文献
- US20200309674A1 STRUCTURAL ELECTRONICS WIRELESS SENSOR NODES 公开/授权日:2020-10-01
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