- 专利标题： Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
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申请号： US17227525申请日： 2021-04-12
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公开(公告)号： US11955346B2公开(公告)日： 2024-04-09
- 发明人: Shijian Luo , Jonathan S. Hacker
- 申请人： Micron Technology, Inc.
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Perkins Coie LLP
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/00 ; H01L23/31
摘要：
A semiconductor device includes a substrate including traces, wherein the traces protrude above a top surface of the substrate; a prefill material over the substrate and between the traces; a die attached over the substrate; and a wafer-level underfill between the prefill material and the die.
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