Invention Grant
- Patent Title: Button module
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Application No.: US17898730Application Date: 2022-08-30
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Publication No.: US11955298B2Publication Date: 2024-04-09
- Inventor: Te-Wei Huang , Zih-Siang Huang , Jhih-Wei Rao , Hung-Chieh Wu , Liang-Jen Lin
- Applicant: ASUSTEK COMPUTER INC.
- Applicant Address: TW Taipei
- Assignee: ASUSTEK COMPUTER INC.
- Current Assignee: ASUSTEK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: MUNCY, GEISSLER, OLDS & LOWE, P.C.
- Priority: TW 1101403 2022.01.13
- Main IPC: H01H21/22
- IPC: H01H21/22

Abstract:
A button module is provided. The button module comprises a base, a pressing part, and an elastic part. The pressing part includes a fixed end and a free end. The fixed end is pivotally connected to the base in a first axial direction. The elastic part is disposed on a side of the pressing part facing the base. The elastic part includes a first damping portion and a second damping portion selectively pressing against the base, where a hardness of the first damping portion is different from a hardness of the second damping portion.
Public/Granted literature
- US20230223218A1 BUTTON MODULE Public/Granted day:2023-07-13
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