Invention Grant
- Patent Title: Electronic devices in semiconductor package cavities
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Application No.: US17001429Application Date: 2020-08-24
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Publication No.: US11942386B2Publication Date: 2024-03-26
- Inventor: Christopher Daniel Manack , Patrick Francis Thompson , Qiao Chen
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Frank D. Cimino
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/495
Abstract:
In examples, a semiconductor device comprises a semiconductor package including a mold compound covering a semiconductor die. The semiconductor package has a surface and a cavity formed in the surface. The semiconductor device comprises an electronic device positioned within the cavity, the electronic device coupled to the semiconductor die via a conductive terminal extending through the mold compound.
Public/Granted literature
- US20220059423A1 ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES Public/Granted day:2022-02-24
Information query
IPC分类:
