- 专利标题: Wearable electronic device having heat dissipation structure
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申请号: US17980721申请日: 2022-11-04
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公开(公告)号: US11921553B2公开(公告)日: 2024-03-05
- 发明人: Jungkeun Lee , Chunsik Choi , Yonghee Jeung
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Cha & Reiter, LLC
- 优先权: KR 20200087992 2020.07.16
- 主分类号: G06F1/20
- IPC分类号: G06F1/20 ; G02B27/01 ; G06F1/16
摘要:
According to an embodiment disclosed in the present document, an electronic device may include: a lens frame at least partially including a thermally conductive material; a pair of wearable members which can be rotatably coupled to the lens frame; at least one lens disposed in the lens frame; and transparent conductive lines disposed on the lens. The transparent conductive lines may be connected to the thermally conductive material of the lens frame to receive heat transferred from the lens frame. Other various embodiments are possible.
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