- 专利标题: Thermoelectric module
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申请号: US17282532申请日: 2019-10-04
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公开(公告)号: US11903316B2公开(公告)日: 2024-02-13
- 发明人: Toshihiko Kishizawa , Shinichi Fujimoto , Manabu Ishii , Hideaki Yamagishi , Fumitaka Ueno
- 申请人: KELK Ltd.
- 申请人地址: JP Kanagawa
- 专利权人: KELK Ltd.
- 当前专利权人: KELK Ltd.
- 当前专利权人地址: JP Kanagawa
- 代理机构: Fish & Richardson P.C.
- 优先权: JP 18190383 2018.10.05 JP 19100588 2019.05.29
- 国际申请: PCT/JP2019/039273 2019.10.04
- 国际公布: WO2020/071529A 2020.04.09
- 进入国家日期: 2021-04-02
- 主分类号: H10N10/817
- IPC分类号: H10N10/817 ; H10N10/852 ; H10N10/01
摘要:
A thermoelectric module includesa plurality of electrodes (high temperature side electrodes and low temperature side electrodes, thermoelectric conversion elements (p-type element and n-type element) arranged between the two electrodes, and a bonding layer disposed between the electrodes and the thermoelectric conversion elements. The bonding layer includes copper-containing particles, copper balls each having a particle diameter of 30 μm or more, an intermetallic compound of copper and tin, and a fired resin.
公开/授权文献
- US20210351333A1 THERMOELECTRIC MODULE 公开/授权日:2021-11-11
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