Invention Grant
- Patent Title: Member connection method
-
Application No.: US16757798Application Date: 2018-10-23
-
Publication No.: US11887960B2Publication Date: 2024-01-30
- Inventor: Motohiro Negishi , Hideo Nakako , Yuki Kawana , Dai Ishikawa , Chie Sugama , Yoshinori Ejiri
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: RESONAC CORPORATION
- Current Assignee: RESONAC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: FITCH, EVEN, TABIN & FLANNERY, LLP
- Priority: JP 17204686 2017.10.23
- International Application: PCT/JP2018/039372 2018.10.23
- International Announcement: WO2019/082896A 2019.05.02
- Date entered country: 2020-04-21
- Main IPC: H01L23/00
- IPC: H01L23/00 ; B22F7/06 ; B22F7/08 ; B23K35/02 ; B23K35/30 ; B22F1/05 ; B22F1/107 ; B22F7/04 ; B22F1/102 ; B22F1/052
Abstract:
This member connection method includes a printing step. In the printing step, a coating film-formed region in which the coating film is formed, and a coating film non-formed region in which the coating film is not formed are formed in the print pattern, and the coating film-formed region is divided into a plurality of concentric regions and a plurality of radial regions by means of a plurality of line-shaped regions provided so as to connect various points, which are separated apart from one another in the marginal part of the connection region.
Public/Granted literature
- US20210351157A1 MEMBER CONNECTION METHOD Public/Granted day:2021-11-11
Information query
IPC分类:
