发明授权
- 专利标题: Coil component
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申请号: US16990273申请日: 2020-08-11
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公开(公告)号: US11875931B2公开(公告)日: 2024-01-16
- 发明人: Hye Mi Yoo , Dong Hwan Lee , Hwi Dae Kim , Sang Soo Park , Chan Yoon , Dong Jin Lee
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR 20200065100 2020.05.29
- 主分类号: H01F5/00
- IPC分类号: H01F5/00 ; H01F27/33 ; H01F27/28 ; H01F27/32 ; H01F27/29
摘要:
A coil component includes a winding-type coil including a coil portion and first and second lead-out portions respectively connected to the coil portion; a body in which the winding-type coil is disposed, the first and second lead-out portions of the winding-type coil exposed from the body; a noise removal portion including a pattern portion spaced apart from a metal wire of the winding-type coil in the body and having both end portions spaced apart from each other to have an open-loop, and a third lead-out portion connected to the pattern portion and exposed from the body; an insulating layer disposed between the winding-type coil and the noise removal portion; and first to third external electrodes arranged on the body to be spaced apart from each other and respectively connected to the first to third lead-out portions.
公开/授权文献
- US20210375535A1 COIL COMPONENT 公开/授权日:2021-12-02
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