A copper coated AC drain pan basin, which has a drain pan assembly having a first layer of an adhesive substance and a second layer of copper. The drain pan assembly has a pan base, first and second longitudinal walls, first and second transversal walls, and an outlet. The pan base has a base top face. The adhesive substance is spread homogeneously onto the base top face. The copper is spread homogeneously onto the adhesive substance. The copper inhibits a growth of microorganisms in a water collected by the drain pan assembly.