Invention Grant
- Patent Title: Emulating parameters of a fluid ejection die
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Application No.: US17863934Application Date: 2022-07-13
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Publication No.: US11840075B2Publication Date: 2023-12-12
- Inventor: John Rossi , Erik D. Ness , James Michael Gardner , Scott A. Linn
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- Main IPC: B41J2/36
- IPC: B41J2/36 ; B41J2/045

Abstract:
An integrated circuit includes thermal tracking logic, control logic, and an output interface. The thermal tracking logic determines a temperature of a fluid ejection die. The control logic defines an emulated parameter of the fluid ejection die as a function of the temperature of the fluid ejection die. The output interface outputs the emulated parameter to a printer system based on the function and the temperature of the fluid ejection die.
Public/Granted literature
- US20220348005A1 EMULATING PARAMETERS OF A FLUID EJECTION DIE Public/Granted day:2022-11-03
Information query
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