In some embodiments, an apparatus includes a first connector including a first housing portion having top and bottom surfaces and a second connector including a second housing portion having top and bottom surfaces. The second housing portion has a form factor substantially corresponding to a form factor of the first housing portion. A circuit board having top and bottom surfaces is permanently coupled to the first housing portion and to the second housing portion such that a first portion of the bottom surface of the circuit board contacts at least a portion of the top surface of the first housing portion and a second portion of the bottom surface of the circuit board contacts at least a portion of the top surface of the second housing portion. A contact assembly is coupled to the first housing portion and electrically and directly engages a portion of the bottom surface of the circuit board.