- 专利标题: Multi-piece layered honeycomb extrusion dies and methods of making same
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申请号: US17103524申请日: 2020-11-24
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公开(公告)号: US11780115B2公开(公告)日: 2023-10-10
- 发明人: Samir Biswas , Memduh Volkan Demirbas , Ryan Joseph Grohsmeyer , Mark Lee Humphrey , Zakariya Radwan Khayat , Kenneth Richard Miller
- 申请人: CORNING INCORPORATED
- 申请人地址: US NY Corning
- 专利权人: Corning Incorporated
- 当前专利权人: Corning Incorporated
- 当前专利权人地址: US NY Corning
- 代理商 Joseph M. Homa
- 主分类号: B29C48/00
- IPC分类号: B29C48/00 ; B28B3/26
摘要:
Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.
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